Job Description : Asst Manager - Mechanical Design

Summary :

Experience : 3 + Years

Location : Samtel Thales Avionics Limited, Greater Noida

Education : ME/M.Tech/ME / B.Tech. - Mechanical

Industry Type : R&D, Manufacturing of state-of-the-art aviation grade displays based on LCDs & other related technologies

Role : Design & Engineering, Product Testing, Prototyping

Functional Area : Mechanical packaging design for LCD Based Display Technology

Desired Candidate Profile :

- Independently carry out the mechanical Design work for the Avionics Displays & other products under New Product Development projects.

- Foresee the Structural and Thermal Design Risks and be a guide for Electronics Hardware packaging design verification to meet given Form, Fit and Functional requirements.

- Guide and be a part of team for EMI EMC management related to mechanical packaging design

- Guide and influence decisions in design of packaging and enclosures for electronic assemblies considering DFMA, thermal and structural integrity best practices.

- Create requisite documentation related to Mechanical product design.

- Coordinate all technical and project management work related to Mechanical design with cross functional team for the assigned project

- Independently carry out Or Coordinate out-sourcing work of the part fabrication, Design Verification Analysis (Structural +Thermal Analysis)

- Mechanical part - M parts /Plastic Parts vendor development/ interface with the vendor with sufficient knowledge of CNC milling, CNC bending, CNC laser cutting, Plastic injection molding etc for interaction with the vendors

- Design of Assembly & Test Fixtures

- Design of sheet metal, die casting components

Skills :

- Ability to handle the project work completely and independently from requirements capturing, analysis and design to taking the project through the stage review process till the validation of the design.

- Have Hands-on skills on Solid Works (3D Modelling) for complex Electronics equipment- s, AutoCAD, Pro-E

- Knowledge of electrical components placement on PCB with considerations for weight, vibration & shock, EMI etc

- Have good knowledge & Hands-on skills on Structural (Nastran) & Thermal (Flowtherm /CFDesign) analysis software.

- Have fundamental knowledge (inputs, boundary conditions etc) of Thermal and structural Analysis requirements from product and process point of view.

- Have good knowledge of mechanical design techniques like GD&T and Tolerance stack up.

- Knowledge on processes like riveting, welding etc

- Knowledge of IP67 compliant mechanical packaging design & practices.

- Knowledge and hands on skills for Design for Manufacturability & Design for Assembly

- Knowledge of DTC (Design to cost) best practices

- Possess sufficient knowledge of detail drawing/document creation and drafting practices.

- Knowledge of surface finish paints/.coatings- Anodization, Chromatization as per applicable MIL & FED standards

- Experience (3 + years)

- Experience in designing Mechanical sub-systems/systems and preferably Avionics Electronics packaging.

- Experience of working on Structural and Thermal analysis of Electronics boards and equipment's including interpretation of the results from the analysis to take the decision for design modifications.

- Experience of RTCA-DO-160x / MIL-STD-810x / JSS 55555 related environmental test requirements like Vibration, Shock, temperature etc and the ability to translate the requirements to Design verification parameters.

- Exposure in Mechanical design aspects of Electronics components design like design of Heat sinks, Vibration isolation, Manufacturing processes and should understand the thermal effects of Electrical/Electronic components placement on PCB with considerations to effective thermal management, vibration, EMI/EMC etc

- Decent exposure to relevant Aerospace & ASTM design and material standards.

Other Attributes :

- Good analytical and problem solving skills

- Compatibility so as to easily integrate in a Cross functional team

- Curiosity and eagerness to learn new technologies

- Be a team player, have the right attitude and be willing to work in challenging environment

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