Program Lead Engineer - Mechanical - Semiconductors/Electronics (10-14 yrs)
Primary Responsibilities :
- Position will be owning, executing & realizing results per allocated project & contribute to short-term & long-term dept. goals & objectives as initiatives with key aspect being capability. These projects would be driven as part of New Product Development (NPD), Continuous Improvement Programs (CIP), cost reduction and/or reliability improvement initiatives
- Understands & attains execution of all Lam business processes, standards & compliances and best practices.
- Leading & realizing project or program commitments consistent with established business processes & by adhering to all engineering due diligence (DFMA, dFMEA, tolerance, calculations, FEA - static & dynamic, DFX.)
- Responsible & accountable to execute medium to high complex sub-system related projects with full ownership & continually works to expand ownership on adjacent modules by acquiring new capabilities.
- Contribute to maturing design of thermo electro-mechanical systems.
Other Job Responsibilities :
- Provide technical leadership, coaching & mentoring to enable engineers in the team to meet job expectations.
- Drive change by contributing to Productivity and by working on continuous improvement & innovations to influence system architecture with end objective (NX, drawings, GD&T, standards, change mgmt. process)
- Ability to handle customer escalations, field problems including troubleshooting, containment actions, failure analysis report & corrective actions.
Minimum Qualifications/Mandatory Skills :
- Master's in Design/Thermal Engineering with minimum 10 years of relevant experience - preferred (or)
- Bachelor's in Mechanical Engineering with minimum 14 years of relevant experience
- Hands on experience of product development on thermo-mechanical systems of high complexity including Cryo components with execution knowledge of NPD process & engineering due-diligence with problems involving flow, pressure through DOE, testing & statistical approach
- Demonstrated ability to conduct design reviews, seek approval in collaboration with stakeholders to implement design, also contribute to other's design
- Demonstrated leadership skills on decision making and problem-solving in the absence of complete or accurate data, while working with team & also contributing to product/process differentiation through innovation along with working knowledge of Team center and NX or any other CAD tool, SAP PLM release process, product structure and configurations
Preferred Qualifications/Desired Skills :
- Product engineering experience in SEMI & in specific design contributions to Etch chamber, Temperature Control Units (TCU), CRYO related assemblies, Bias Housing, RF and Plasma chemistry
- Excellent verbal and written communication skills; ability to present design concepts to peers and management in a professional and effective way
- Good understanding of semiconductor manufacturing processes, equipment, industry standards (SEMI, OSHA, ASME etc.
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